latest research on electronics

January 3, 2024

Scientists Finally Invent Heat-Controlling Circuitry That Keeps Electronics Cool

A new thermal transistor can control heat as precisely as an electrical transistor can control electricity

By Rachel Nuwer

Birdlkportfolio/Getty Images

From smartphones to supercomputers , electronics have a heat problem. Modern computer chips suffer from microscopic “hotspots” with power density levels that exceed those of rocket nozzles and even approach that of the sun’s surface. Because of this, more than half the total electricity burned at U.S. data centers isn’t used for computing but for cooling . And many promising new technologies—such as 3-D-stacked chips and renewable energy systems—are blocked from reaching their full potential by errant heat that diminishes a device’s performance, reliability and longevity.

“Heat is very challenging to manage,” says Yongjie Hu, a physicist and mechanical engineer at the University of California, Los Angeles. “Controlling heat flow has long been a dream for physicists and engineers, yet it’s remained elusive.”

But Hu and his colleagues may have found a solution. As reported last November in Science, his team has developed a new type of transistor that can precisely control heat flow by taking advantage of the basic chemistry of atomic bonding at the single-molecule level. These “thermal transistors” will likely be a central component of future circuits and will work in tandem with electrical transistors. The novel device is already affordable, scalable and compatible with current industrial manufacturing practices, Hu says, and it could soon be incorporated into the production of lithium-ion batteries, combustion engines, semiconductor systems (such as computer chips), and more.

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“This invention represents a revolutionary breakthrough with immense practical applications,” Hu says. “Simply speaking, there’s been no available way for precise heat control before this.”

Electrical transistors were invented in 1947 and changed the world by enabling engineers to precisely control electricity. These devices, which are now a critical component of basically all electronics, act like switches: they consist of two terminals through which electricity flows, plus a third terminal that controls the flow. Today it’s possible to squeeze billions of transistors onto a single chip, and while this miniaturization has exponentially increased computing power, it has also made dealing with excess heat even more challenging.

With the right technology, though, wasted heat could not only be captured to prevent damage to the chip; it could also be harnessed and reused. “Today most heat in electronic circuitry is considered a nuisance, and one just tries to channel it away, whereas it should really be put to work,” says Alex Zettl, an experimental physicist at the University of California, Berkeley, who was not involved in the new study. “In the future, I suspect electronic and thermal circuitry will work hand in hand.”

During the past two decades, research teams such as Hu’s have been trying to usher in this future by developing thermal transistors to control heat flow as precisely as electrical transistors control electrical currents. Several fundamental challenges have stood in their way, however. Previous thermal transistor designs, for example, often relied on unwieldy moving parts that slow down processing times. And structural problems have also caused such devices to fail. “There’s been lots of interest in the field, but none [of these past attempts] have been successful,” Hu says.

To circumvent these limitations, Hu and his colleagues have spent a decade developing an entirely new approach to building a thermal transistor. Their technique takes advantage of the bonds that form between atoms in a nanoscale channel of the new transistor. These bonded atoms are held together by sharing their electrons, and the way these electrons are distributed between them affects the strength of the bonds. This, in turn, influences how much heat can pass through the atoms.

Hu and his colleagues found they could manipulate these variables by using a nanoscale electrode that applies an electrical field to precisely control the movement of heat. Similarly to an electrical transistor, the new device consists of two terminals between which heat flows and a third that controls this flow—in this case, with the electrical field, which adjusts the interactions between electrons and atoms within the device. This leads to changes in thermal conductivity and enables precise control of heat movement.

With the device’s invention, Hu says, heat can now “be manipulated for many applications according to our needs.” This includes preventing overheating in computers and even recapturing this once wasted energy for reuse.

The new device set records and performed better by several orders of magnitude in the team’s experiments, compared with other recently engineered thermal transistors that don’t use atomic-level bonding. Its “new and elegant” design directs cooling power to specific areas at “excellent” speeds, says Joseph Heremans, an experimental physicist at the Ohio State University, who was not involved in the research. In experiments, the team found that the new device also dramatically dampened heat spikes by 1,300 percent and achieved all of this control with high reliability.

Geoff Wehmeyer, a mechanical engineer at Rice University, who also was not involved in the new study, adds that the novel technique of manipulating bonding between atoms with electricity to control heat will likely “motivate a great deal of further fundamental research.”

More work is still needed before the new device can “change the world,” Zettl says. Crucially, future research must first create fully hybrid electronic-thermal circuitry, which will require integrating the new heat-controlling circuitry with existing electric ones. But Zettl does think the new device achieves the main underlying goal of “elegantly [coupling] electronics with thermal energy flow, which, in the long run, is the name of the game.”

Hu and his colleagues are already experimenting with the device’s structure and materials to further improve its performance. They are also studying ways to integrate it into different systems, including 3-D-stacked chips. These arrangements address a fundamental scaling challenge by stacking 2-D chips, but they have been uniquely challenging to cool.

Tiny heat-controlling transistors might have medical applications as well. Hu’s team is working with oncologists to investigate whether thermal transistors could advance a type of cancer treatment called hyperthermia therapy, which uses magnetic particles to deliver deadly levels of heat to malignant cells. Hu says that thermal transistors could potentially be incorporated into probes or nanoparticles to provide oncologists with precise control over heating, which would better ensure that cancer cells were annihilated and healthy cells were spared.

Just as the invention of the electrical transistor sparked a wave of innovation that ushered in the current technological era, Hu predicts that thermal transistors could likewise lead to breakthroughs that are impossible to envision now. “This invention opens up tremendous opportunities in heat management, heat processing and new computing paradigms,” Hu says. “Thermal transistors are a gateway to the future.”

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5 Electrical Engineering Research Projects Making Their Mark in 2024

Join our engineering community sign-in with:, from 3d processors to self-powered sensors, these academic research projects show how "the next big thing" in electronics may emerge from labs worldwide..

Many of the most influential hardware companies can trace their origins back to a university lab. Even RISC-V, the open-source ISA taking the hardware world by storm, had its humble beginnings at the University of California, Berkeley, in 2010. Only a few months into 2024, several projects from universities worldwide—from MIT in Boston to Shibaura Institute of Technology in Japan, have caught our attention. Here's our editor's pick of five electrical engineering research projects to keep an eye on. 

MIT: Magnetic Energy Harvesting Sensor

MIT researchers have developed a self-powered, battery-free sensor that harvests magnetic energy from its surroundings. This sensor, designed for difficult-to-access areas like ship engines, can monitor power consumption and operations over extended periods without the need for battery replacement or special wiring.

System diagram of the self-powered sensor. Image used courtesy of IEEE

It operates by leveraging the ambient magnetic fields generated around electrical wires, enabling it to clip onto a wire and autonomously harvest energy. This energy is then used to monitor the temperature of the motor it is attached to. The researchers believe this innovation could lead to networks of maintenance-free sensors for various applications, significantly reducing installation and maintenance costs and potentially transforming the landscape of sensor deployment in industrial settings, manufacturing plants, and beyond.

Caltech: Tying Knots Inside Lasers

Caltech's recently published its latest research on mode-locked lasers, lasers that emit light in steady pulses instead of in one continuous beam. The team effectively created a  "knot" within the laser pulses , enhancing their resilience to imperfections and environmental disturbances.

“Tying to knot” with lasers. Image used courtesy of Caltech

Such topological temporal mode-locking could significantly improve the stability and performance of frequency combs—crucial tools in modern communication, sensing, and computing applications. By ensuring that these laser pulses can withstand external shocks without losing coherence, the research opens new avenues for developing advanced sensing technologies and more reliable communication systems.

University of Florida: 3D Processors for Wireless Comms

The University of Florida's electrical engineering department has developed a three-dimensional processor it claims may "transform the landscape of wireless communication." The researchers aim to address the inherent limitations of traditional planar processors by embracing the third dimension, leading to unprecedented compactness and efficiency in data transmission. 

A 3D filter created from connecting ferroelectric-gate fin resonators with different frequencies. Image used courtesy of the University of Florida

These 3D nanomechanical resonators, fabricated using CMOS technology, integrate different frequencies on one monolithic chip. The team calls this device a new type of spectral processor, taking a new approach to multi-band, frequency-agile radio chipsets to meet the surging demands for seamless connectivity and real-time data exchange. The potential applications are wide-ranging, from smart city infrastructures to remote healthcare services and immersive augmented reality experiences.

Shibaura Institute of Technology: Enhancing Electrical Fire Safety

At the Shibaura Institute of Technology, researchers have made a significant breakthrough in electrical fire safety by developing a method for detecting arc faults in low-voltage AC systems. Arc faults, one the leading causes of electrical fires, occur when two conductors electrically discharge because of poor contact, causing sparks as hot as 1,000°C. 

The researchers observed that when a copper oxide bridge burns at high temperatures, an arc fault occurs, turning the bridge into an insulator and creating a loop in the conducting path. In a theoretical simulation of this phenomenon, the team saw a unique current waveform, termed the "current shoulder," appear in arc faults with copper contacts. 

 No arc-fault state vs. arc-fault state under various types of loads. Image used courtesy of SIT

A current transformer can detect this current shoulder when the voltage disparities between arc-fault and non-arc-fault states offset changes in the transformer's magnetic flux. This discovery improves the accuracy of arc-fault detection and may subsequently reduce the risk of electrical fires in residential and commercial buildings.

National University of Singapore: Record Solar Cell Efficiency

The National University of Singapore has achieved a milestone in solar cell technology by developing triple-junction tandem solar cells with a world-record efficiency of 27.1%. This feat was accomplished by integrating a novel pseudohalide, cyanate, into perovskite solar cells—a move that not only stabilized the perovskite structure but also significantly reduced energy loss. 

The NUS triple-junction solar cell. Image used courtesy of NUS

The success of these cyanate-integrated perovskite solar cells in achieving higher voltages and maintaining stability under continuous operation marks a significant step forward in the quest for more efficient and sustainable energy solutions. 

Electronics Research Marches On

Have you heard of or participated in any recent research moving the needle in electrical engineering? How might the project affect specific industries? Tell us about it in the comments below.

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The latest electronics research news from within the industry and universities from around the world.

Air-stable organic flow batteries

Posted on 29th August 2024 | Modified on 29th August 2024 Research Leave a comment

Researchers at the Chinese Dalian Institute of Chemical Physics have produced stable organic redox compounds for use in aqueous flow batteries. “Organic redox-active molecules [ORAMs] are abundant and diverse, offering significant potential for energy storage, particularly in aqueous organic flow batteries,” according to the Institute. “However, ensuring the stability of the ORAMs during the charge and discharge process is critical, ...

Stretchy gel sensor measures biomarkers on dry skin

Posted on 19th August 2024 | Modified on 20th August 2024 Medical Electronics , Research , Sensors Leave a comment

Health-related chemicals can be detected on dry skin, according to the National University of Singapore (NUS), which developed a stretchable ‘ionic-electronic bilayer hydrogel’ sensor with the Singapore Agency for Science, Technology and Research (A*Star). The chemicals are known as solid-state epidermal biomarkers. “These biomarkers, which include cholesterol and lactate, are found in the stratum corneum, the outermost layer of the ...

Another glimpse behind the superconductivity curtain

Posted on 16th August 2024 | Modified on 16th August 2024 Research Leave a comment

Emerging electron pairs in an insulator hint of a hidden mechanism that could be exploited for designer ‘high-temperature’ superconductors. Superconductors need electrons to pair, and then many pairs to become coherent inside the material. “The electron pairs are telling us that they are ready to be superconducting, but something is stopping them,” said Ke-Jun Xu, a researcher at Stanford University’s ...

Modern twist on clockwork stores more energy

Posted on 29th July 2024 | Modified on 29th July 2024 Research Leave a comment

Forget exploiting carbon nanotubes electrochemically, and just wind them up like clockwork if you want to store energy. This is not quite the message that researchers at the University of Maryland Baltimore County are delivering, but it might as well be as a team from there is storing 2.1MJ/kg in twisted carbon nanotubes – more, weight-for-weight, than Li-ion chemistry can ...

Switch to scandium for high temperature ferroelectrics

Posted on 26th July 2024 | Modified on 26th July 2024 Research Leave a comment

Tokyo Tech has picked aluminium scandium nitride (AlScN) to make ferroelectric films that remain stable at up to 600°C in hydrogen. “This high stability makes them ideal for high-temperature manufacturing processes under the H2-included atmosphere used in fabricating advanced memory devices,” said the university. “Compared to existing ferroelectric materials, these films maintain their ferroelectric properties and crystal structure even after ...

Just what are microbial sensors capable of?

The Defense Advanced Research Projects Agency (DARPA) has teamed up with Massachusetts-based Draper to streamline the design of microbe-based electronic sensors. “Microbes have the potential to be developed as biological sensors that can collect vital information about the environments they naturally inhabit,” said Draper biotechnologist Chris Vaiana. “Our goal is to support DARPA in mapping the modular design of microbe-based ...

300mm silicon-based quantum dot spin qubits

Posted on 24th July 2024 | Modified on 24th July 2024 Research Leave a comment

Imec has used 300mm wafers to demonstrate silicon-based quantum dot spin qubit processing. The devices had an average charge noise of 0.6µeV/√Hz at 1Hz. “In view of noise performance, the values obtained are the lowest charge noise values achieved on a 300mm fab-compatible platform,” according to the Belgian research lab. “By demonstrating those values, repeatedly and reproducibly this work makes ...

Making a ‘biodegradeable’ plastic biodegradeable

Posted on 22nd July 2024 | Modified on 22nd July 2024 Research Leave a comment

PLA – poly lactic acid – is a 3d printable polymer that can be made from maize and is biodegradable. Except, it is seldom publicised, that it is only biodegradeable in industrial-scale high temperature processes, and will last of years in the open environment. Now researchers at the Toulouse Biotechnology Institute have engineered a designer enzyme – hyperthermostable PLA hydrolase ...

Self-healing protection for perovskite solar

City University of Hong Kong (CityUHK) has developed another approach to quell the self-destructive tendencies of perovskite solar cells in the face of moisture. It is a corrosion inhibitor that tackles ionic defects in the perovskite layer within the solar cell stack, even those created after manufacture. “Applying a living passivator on the perovskite surfaces enhances their resistance to environmental ...

Digitally-tuned capacitors for 6G RF front-ends

Posted on 18th July 2024 | Modified on 18th July 2024 Communications , Research Leave a comment

Nanusens has demonstrated a mems digitally-tuneable capacitor for 5G and 6G RF front-ends, that is compatible with CMOS IC processing and can be integrated with circuitry. The Q-factor is above 100 at 1GHz, and the four-bit capacitor has a minimum capacitance of 450fF (30fF/capacitor) with them all off and tunes up to ~1pF – a capacitance ratio of 2.2 which ...

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February 24, 2022

Live wire: New research on nanoelectronics

by Arizona State University

Proteins are among the most versatile and ubiquitous biomolecules on earth. Nature uses them for everything from building tissues to regulating metabolism to defending the body against disease.

Now, a new study shows that proteins have other, largely unexplored capabilities. Under the right conditions, they can act as tiny, current-carrying wires, useful for a range human-designed nanoelectronics.

In new research appearing in the journal ACS Nano, Stuart Lindsay and his colleagues show that certain proteins can act as efficient electrical conductors. In fact, these tiny protein wires may have better conductance properties than similar nanowires composed of DNA, which have already met with considerable success for a host of human applications.

Professor Lindsay directs the Biodesign Center for Single-Molecule Biophysics. He is also professor with ASU's Department of Physics and the School of Molecular Sciences.

Just as in the case of DNA, proteins offer many attractive properties for nanoscale electronics including stability, tunable conductance and vast information storage capacity. Although proteins had traditionally been regarded as poor conductors of electricity, all that recently changed when Lindsay and his colleagues demonstrated that a protein poised between a pair of electrodes could act as an efficient conductor of electrons .

The new research examines the phenomenon of electron transport through proteins in greater detail. The study results establish that over long distances, protein nanowires display better conductance properties than chemically-synthesized nanowires specifically designed to be conductors. In addition, proteins are self-organizing and allow for atomic-scale control of their constituent parts.

Synthetically designed protein nanowires could give rise to new ultra-tiny electronics, with potential applications for medical sensing and diagnostics, nanorobots to carry out search and destroy missions against diseases or in a new breed of ultra-tiny computer transistors. Lindsay is particularly interested in the potential of protein nanowires for use in new devices to carry out ultra-fast DNA and protein sequencing , an area in which he has already made significant strides.

In addition to their role in nanoelectronic devices, charge transport reactions are crucial in living systems for processes including respiration, metabolism and photosynthesis. Hence, research into transport properties through designed proteins may shed new light on how such processes operate within living organisms.

While proteins have many of the benefits of DNA for nanoelectronics in terms of electrical conductance and self-assembly, the expanded alphabet of 20 amino acids used to construct them offers an enhanced toolkit for nanoarchitects like Lindsay, when compared with just four nucleotides making up DNA.

Transit Authority

Though electron transport has been a focus of considerable research, the nature of the flow of electrons through proteins has remained something of a mystery. Broadly speaking, the process can occur through electron tunneling, a quantum effect occurring over very short distances or through the hopping of electrons along a peptide chain—in the case of proteins, a chain of amino acids.

One objective of the study was to determine which of these regimes seemed to be operating by making quantitative measurements of electrical conductance over different lengths of protein nanowire. The study also describes a mathematical model that can be used to calculate the molecular-electronic properties of proteins.

For the experiments, the researchers used protein segments in four nanometer increments, ranging from 4-20 nanometers in length. A gene was designed to produce these amino acid sequences from a DNA template, with the protein lengths then bonded together into longer molecules. A highly sensitive instrument known as a scanning tunneling microscope was used to make precise measurements of conductance as electron transport progressed through the protein nanowire.

The data show that conductance decreases over nanowire length in a manner consistent with hopping rather than tunneling behavior of the electrons. Specific aromatic amino acid residues, (six tyrosines and one tryptophan in each corkscrew twist of the protein), help guide the electrons along their path from point to point like successive stations along a train route. "The electron transport is sort of like skipping stone across water—the stone hasn't got time to sink on each skip," Lindsay says.

Wire wonders

While the conductance values of the protein nanowires decreased over distance, they did so more gradually than with conventional molecular wires specifically designed to be efficient conductors.

When the protein nanowires exceeded six nanometers in length, their conductance outperformed molecular nanowires, opening the door to their use in many new applications. The fact that they can be subtly designed and altered with atomic scale control and self-assembled from a gene template permits fine-tuned manipulations that far exceed what can currently be achieved with conventional transistor design.

One exciting possibility is using such protein nanowires to connect other components in a new suite of nanomachines. For example, nanowires could be used to connect an enzyme known as a DNA polymerase to electrodes, resulting in a device that could potentially sequence an entire human genome at low cost in under an hour . A similar approach could allow the integration of proteosomes into nanoelectronic devices able to read amino acids for protein sequencing.

"We are beginning now to understand the electron transport in these proteins. Once you have quantitative calculations, not only do you have great molecular electronic components, but you have a recipe for designing them," Lindsay says. "If you think of the SPICE program that electrical engineers use to design circuits, there's a glimmer now that you could get this for protein electronics."

Journal information: ACS Nano

Provided by Arizona State University

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Microelectronic devices are vital to nearly every aspect of our lives—from running a small business to driving the global economy, from tracking our personal health to fighting a pandemic, and from delivering power to our homes to securing our nation’s infrastructure.

Microelectronics include computer chips, power electronics like those that control electricity, and other small semiconductor devices. Since the mid-20 th century, microelectronic devices have rapidly decreased in size and cost and increased in performance and energy efficiency—changing the world in a short time. However, these transformative devices are now facing technical and economic challenges that will require new innovations. This second revolution in microelectronics will apply new understandings in the physical and computational sciences.

For decades, the U.S. Department of Energy Office of Science and the DOE national laboratories have worked with U.S. industry to develop and demonstrate scientific advancements for microelectronics. The Office of Science also operates many scientific user facilities open to the research community that depend on a range of microelectronic devices, including sensitive particle detectors, sophisticated microscopes, intense X-ray and neutron sources, as well as data centers, networks, and high-performance computers.

That’s why the Office of Science created a microelectronics initiative with the goal of stimulating U.S.-based innovation as the foundation for future domestic technology development and manufacturing. Office of Science-funded microelectronics projects will support ever more powerful supercomputing capabilities, explore new materials and fabrication methods, foster advanced computing architectures, and stimulate research and development for a range of microelectronics important to the DOE missions of scientific discovery, energy efficiency, and national security.

Since the 1970s, the semiconductor industry has routinely shrunk the size of transistors, from micrometers to nanometers. The smartphone in your pocket is more powerful than supercomputers were half a century ago—thanks, in part, to miniaturization. Every 18 months or so, chip manufacturers packed in twice as many transistors—famously known as Moore’s law. But as transistors approach the size of atoms, Moore’s law for classical computing is breaking down due to the complex laws of quantum mechanics.

The challenge extends beyond transistor size. Most computer processors are based on the 70-year-old von Neumann model, named for its inventor. In this model, the processing unit is separate but connected to a memory unit, which requires instructions from the processing unit and data from the memory unit to be shuffled back and forth during computation.

This extended data movement consumes energy and creates heat—the so-called von Neumann bottleneck. For supercomputing and data centers, this means building costly power and cooling infrastructures. For scientists wanting to analyze large amounts of data in real time during experiments, memory access and capacity and other data bottlenecks are frustrating roadblocks to scientific discovery.

To confront challenges like the end of Moore’s law and the von Neumann bottleneck, the Office of Science is funding research to design new materials that take advantage of properties at the atomic and subatomic scale. We are also funding research to develop new computing models, including neuromorphic computing that mimics how the brain works and quantum computing that leverages the physics of quantum mechanics to solve new types of complex problems. Data-driven software programs in artificial intelligence and quantum information science will benefit from these new architectures designed for their unique purposes. And there may be others—we will likely see a combination of or hybrid computing models in the future.

However, it’s not just about computers. As the United States upgrades its 100-year-old electricity grid, microelectronics will be the key to adding more renewable energy sources, protecting against cyberattacks, and introducing a two-way flow of electricity between the consumer and the grid, which will optimize use. Scientists are also planning for how future microelectronics will improve research. Energy-efficient, data-nimble microelectronics will allow researchers to collect and analyze more data faster, using devices closer to experimental setups.

The key to accomplishing all this requires a collaborative “co-design” approach that brings together experts from the beginning to the end of the microelectronics pipeline. Historically, each step in the R&D process was carried out independently. However, through co-design, the Office of Science will leverage materials and chemical scientists, mathematicians, computer engineers, industry partners, and others to work together to inform each step of the process and innovate better and faster.

Knowing the big impact that microelectronics has on our lives today, it is critical to prepare this important technology for the future. Microelectronics projects led by the national laboratories will help us bridge the gap between the discovery science we need to understand how to advance microelectronics and introducing these new technologies into the lab and the marketplace. 

The Office of Science is the single largest supporter of basic research in the physical sciences in the United States and is working to address some of the most pressing challenges of our time. For more information, please visit www.energy.gov/science .

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Top 10 Electronics Industry Trends & Innovations in 2025

How is technology enhancing electronics manufacturing workflows? Explore our in-depth industry research on the top 10 electronics manufacturing trends based on our analysis of 1100+ companies. These trends include organic electronics, AI, IoT, 3D-printed electronics, and more!

The electronics manufacturing industry expands, leveraging advanced materials, organic electronics, and miniaturization. Key trends include AI and IoT for smart manufacturing and industry growth. Startups innovate in component design and manufacturing for efficiency and compatibility, while 3D printing enhances the industry’s dynamism and cost-effectiveness. These trends improve the efficiency, durability, and sustainability of electronics.

This article was last updated in July 2024.

Innovation Map outlines the Top 10 Electronics Industry Trends & 20 Promising Startups

For this in-depth research on the Top Electronics Manufacturing Trends & Startups, we analyzed a sample of 1112 global startups & scaleups. This data-driven research provides innovation intelligence that helps you improve strategic decision-making by giving you an overview of emerging technologies in the electronics manufacturing industry. In the Electronics Manufacturing Innovation Map, you get a comprehensive overview of the innovation trends & startups that impact your company.

10 Emerging Electronics Industry Trends in 2025

• Advanced Electronic Materials
• Organic Electronics

Artificial Intelligence

• Internet of Things
• Embedded Systems
• Printed Electronics
• Advanced IC Packaging
• Miniaturized Electronics
• 3D Printing
• Immersive Technologies

Want to explore all Electronics innovations & trends?

Request Sample Database

These insights are derived by working with our Big Data & Artificial Intelligence-powered StartUs Insights Discovery Platform , covering 4.7M+ startups & scaleups globally. As the world’s largest resource for data on emerging companies, the SaaS platform enables you to identify relevant technologies and industry trends quickly & exhaustively.

Tree Map reveals the Impact of the Top 10 Trends in the Electronics Industry

Based on the Electronics Innovation Map, the Tree Map below illustrates the impact of the Top 10 Electronics Engineering Technology Trends in 2025. Advanced materials are required for the fabrication process as common semiconductor materials are unable to achieve miniaturization and sustainability. Similarly, organic electronics address global concerns about sustainability and eco-friendly manufacturing. Electronics manufacturing startups employ AI and IoT in the designing and fabrication processes.

Further, advanced circuit packaging reduces the size of a chip every year and integrates more and more functions. Because of the growing demand for flexibility and customization of embedded systems, startups work on new system architectures and designs. Technologies enabling printed electronics are also gaining traction and 3D printing is gathering a lot more attention due to its decentralized production and rapid prototyping capabilities.

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Global Startup Heat Map covers 1112 Electronics Manufacturing Startups & Scaleups

The Global Startup Heat Map below highlights the global distribution of the 1112 exemplary startups & scaleups that we analyzed for this research. Created through the StartUs Insights Discovery Platform , the Heat Map reveals high startup activity in the US, followed by India and Europe. Below, you get to meet 20 out of these 1112 promising startups & scaleups as well as the solutions they develop. These electronics startups are hand-picked based on criteria such as founding year, location, funding raised, & more. Depending on your specific needs, your top picks might look entirely different.

Top 10 Electronics Technology Trends in 2025

1. advanced electronic materials.

The semiconductor industry has been reliant on silicon for decades, but there is a limit to how far you can etch, lithograph, and pattern a silicon material. As a result, innovation to increase the performance of integrated circuits is coming from new materials and architectures.

Startups and scaleups are developing silicon alternatives and other semiconductor materials or composites such as graphene and nanomaterials for high performance and efficiency.

Odyssey Semiconductor develops Gallium Nitride (GaN) Semiconductor Material

US-based startup Odyssey Semiconductor builds high-performance power-switching gallium nitride (GaN) semiconductor material. Its GaN processing technology allows for the realization of vertical current conduction GaN devices which extend application voltages from 1000V to over 10 000V.

It extends well beyond the consumer electronics application and into applications such as electric vehicles (EVs), industrial motor control, and energy grid applications.

SixLine Semiconductor commercializes Carbon Nanotube Processing

SixLine Semiconductor is a US-based startup that advances carbon nanotube processing. The startup manufactures semiconductor-grade carbon nanotubes that support room-temperature deposition on any substrate. Its technology features high packing density, tight alignment, high-throughput processing, and selective deposition.

The startup’s solution enables electronics manufacturers to mass produce high-performance transistor channels and finds use in manufacturing wireless, computing, and sensor components.

2. Organic Electronics

Organic Electronics offer massive advantages over traditional inorganic electronics. They are cost-effective, flexible, indissoluble, optically transparent, lightweight, and consume low power. In addition, the rise in awareness of sustainable development and eco-friendly manufacturing attracts manufacturers to opt for organic electronics. Designing circuits with microbial components or producing devices with biodegradable and recyclable materials is seen to be the next electronics manufacturing trend.

Moreover, the application of organic materials to manufacture electronic devices enables electronics manufacturers to use safer, fewer, and more abundantly available raw materials. Hence, it creates new business opportunities for companies and this is sure to give them a competitive edge in the long run.

Flask offers Materials for Organic Electronics Devices

Japanese startup Flask develops materials for application in various products such as organic displays, lighting, and solar cells. Examples of materials include electron transport materials, electron injection materials, light-emitting materials, coating materials, and organic solar cell materials.

Using these materials allows device manufacturers to meet customer demands like high efficiency, low power consumption, high reliability, and adaptation to next-generation materials.

Koala Tech develops Organic Semiconductor Laser Diode

Japanese startup Koala Tech develops an organic semiconductor laser diode. The startup’s laser diode technology is based on organic fluorescent semiconductors, which are generally easier, less harmful, and faster to process into thin films.

It enables manufacturers to use a low-cost light source that easily integrates into OLED and organic electronic platforms.

3. Artificial Intelligence

AI-powered solutions are gaining popularity in every sector. AI impacts the growth of semiconductor manufacturing in two ways, one by building demand for innovative AI-capable electronics components, and two, by enhancing the product manufacturing and design processes. The conventional methods have limitations in reshaping product development cycles, improving product design processes, and reducing defects. But the application of AI is solving all these limitations.

The implementation of predictive maintenance in the production lines also allows manufacturers to reduce downtime. Hence, artificial intelligence is one of the most important technologies among the electronics manufacturing trends.

Cybord develops AI-based Component Inspection Software

Israeli startup Cybord offers AI-based component inspection software. The startup uses visual inspection technology powered by artificial intelligence to achieve this. It is capable of doing material sourcing, manufacturing, and defect management of individual components and the assembled product as a whole.

Implementing this software in manufacturing facilities enables electronics companies to assure that each and every assembled component is genuine and untampered.

Celus offers an AI-powered Engineering Platform

German startup Celus creates an AI-powered engineering platform to automate all the manual steps in the engineering process. The startup’s platform automatically finds fitting components with the components’ information blocks available in the engineering platform. It then designs and generates schematics and PCB-floor planning with a single click.

The platform is also designed to fully integrate into an existing electronics manufacturing environment and automate the process from concept to design. In general, it allows manufacturers to reduce product development times and complexity in the development process.

4. Internet of Things

The rapid growth of the Internet of Things represents an unprecedented opportunity for the IoT electronics manufacturing industry. It re-evaluates the fabrication process and manages practices that are found to be difficult to achieve with conventional approaches. In other ways, the IoT enables electronic manufacturing machines to self-process and store data while being digitally connected.

Continuous improvements in the fabrication of sensors are also required since sensors are the key components that enable IoT applications. Further, the transition to 5G-enabled devices requires flawless, innovative chips with more efficient architectures at lower costs.

AnalogueSmith develops Integrated Circuit for IoT Sensor Nodes

Singaporean startup AnalogueSmith specializes in integrated circuit design for IoT sensor nodes. The startup offers complementary metal-oxide-semiconductor (CMOS)-based integration of RF, analog, and digital functionality for integrated circuits.

This CMOS-based approach allows manufacturers to reduce costs without compromising on performance requirements.

Meyvnsystems offers IoT Communication Systems

Singaporean startup Meyvnsystems develops wireless communication systems for IoT devices. The startup offers LTE Cat-M, NB-IoT, wireless LAN, Bluetooth, and 5G systems based on communication distance, power consumption, and data throughput requirements.

This allows IoT manufacturers to mitigate in-house communication system design and reduce development periods.

5. Embedded Systems

Embedded systems are an unavoidable part of any electronic device nowadays and it has a crucial role in deciding the speed, security, size, and power of the devices. Since we are in the transition phase of a connected world, there is high demand for embedded systems.

So the designing and manufacturing sector of such systems is undergoing numerous innovations to improve performance, security, and connectivity capabilities. Further, in electronics manufacturing facilities, these systems are useful for increasing machine control and monitoring.

Dover Microsystems develops Processor Level Security Solutions

US-based startup Dover Microsystems offers security solutions in protecting devices against network-based attacks at the processor level. The startup’s hardware-based technology guards the host processor by monitoring and screening every instruction executed based on a set of security, safety, and privacy rules.

In this way, it empowers processors to protect themselves in real-time from the exploitation of software vulnerabilities. Hence, integrating this technology within embedded systems enables manufacturers to solve the challenges associated with device security.

Luos provides Open-Source and Real-Time Orchestrator for Distributed Architectures

French startup Luos develops an open-source and real-time orchestrator for distributed architectures to easily design, test, and deploy embedded applications. The startup’s solution encapsulates hardware and software functions as microservices.

So, each microcontroller communicates with and recognizes one other, but remains independent of each other. Further, the startup offers a reusable configuration profile and offers more flexibility in the hardware development cycle.

Learn How 10 Emerging Technologies Shape Your Industry!

6. Printed Electronics

Printing electronic components on a semiconductor substrate is the most effective way to reduce the overall cost of the manufacturing process. So, manufacturers are always trying to tackle this challenge by searching for new technologies and advancements in conventional printing technologies.

Unlike traditional semiconductors that use tiny wires as circuits, 3D-printed electronics rely on conductive inks and often flexible films. Further, the advancements in printing technologies allow the flexible hybrid electronics field to obtain enough momentum. Therefore, startups and scaleups are developing solutions for advanced printing technologies.

Omniply develops a Delamination Technique for Printed Electronics

Canadian startup Omniply offers a delamination technology that facilitates the separation of flexible circuits from their rigid carrier. It creates high-performance electronic devices on flexible substrates without compromising device performance or without changing the manufacturing infrastructure.

This delamination technique makes the process cheaper and eco-friendly, compared to traditional delamination methods. In addition, it overcomes resolution and reliability limits associated with printed electronics by using traditional CMOS infrastructure for device fabrication.

TracXon advances Circular & Hybrid Printed Electronics (HPE)

TracXon is a Dutch startup that makes sustainable and hybrid printed electronics. The startup leverages sheet-to-sheet (S2S) and roll-to-roll (R2R) printing, photonic sintering, stencil printing, component assembly, and more to make printed electronics.

The startup’s technology also features a lower carbon footprint and finds applications in the lighting, automotive, healthcare, and electronics industries.

7. Advanced IC Packaging

In recent years, chip packaging has become a hot topic along with chip design. The traditional way to scale a device based on Moore’s law has limitations nowadays. The other way to get the benefits of scaling is to put multiple complex devices in an advanced package. So, semiconductor manufacturers develop new advanced IC packaging technologies to provide greater silicon integration in increasingly miniaturized packages.

The startup also enables manufacturers to offer customization and improve yields by vertically stacking modular components. Besides, advanced IC packaging optimizes manufacturing to balance customer needs against overall costs.

PHIX offers Photonic Integrated Circuit (PIC) Assembly and Packaging

Dutch startup PHIX provides assembly and packaging services for photonic integrated circuits. To make PICs a part of a photonics-enabled module, it needs to be connected to components like optical fibers, other PICs, cooling solutions, and electronics.

The startup designs and manufactures the package in which these connections are made. PHIX allows the semiconductor industry to optimize the PIC and module design, process, and equipment, as well as scale up production.

Onto Innovation develops Advanced IC Packaging Equipment

US-based startup Onto Innovation builds equipment for advanced packaging processes for the semiconductor industry. The startup’s solution, JetStep W2300 System , features specialized large field optics and key system advantages to deliver maximum throughput without limiting resolution.

The startup enables electronics manufacturers to tackle IC packaging challenges along with device performance, quality, and reliability issues.

8. Miniaturized Electronics

Miniaturization enabled the use of electronics in several novel application areas. Particularly, healthcare and automotive industry applications have space limitations in terms of implementing specific devices. Previously, the miniaturization concept was limited by their practical handling, display, and battery, but not by the built-in electronics.

There are innovations happening to make electronic components as small as possible by maintaining speed, reliability, and efficiency. Another important aspect of miniaturization is the integration of more and more features into a single component. For example, nanonet sensors and forksheet FET are a couple of recent developments in miniaturized electronic components.

Alixlabs offers an ALE-Based Method of Manufacturing Nanostructures

Swedish startup AlixLabs provides an atomic layer etching (ALE)-based method for manufacturing nanostructures with a characteristic size below 20 nm. The startup’s technology achieves nanostructure fabrication beyond the resolution limit for optical and electron beam lithography.

The startup also enables an economically affordable way of transistor channel scaling for sub-20 nm technology nodes. Further, this allows for a higher level of device integration, in turn, reducing costs, increasing speed, and lowering the energy consumption of devices.

Spectricity provides Spectral Sensing Solutions

Belgian startup Spectricity develops miniaturized integrated spectral sensing solutions. The startup’s patented wafer-scale hyperspectral filter technology, combined with CMOS integration processes, results in miniaturized sensors.

Unlike other solutions, its filters do not require complex and bulky optics or packaging, slow scanning, or sophisticated calibration. Hence, it produces sensing devices compatible with the size, power consumption, and cost requirements of mobile devices.

9. 3D Printing

Additive manufacturing in the electronics industry eliminates the need for flat circuit boards. It enables new innovative designs and shapes that cannot be produced through conventional means. 3D printers also fabricate electronic components as a single, continuous part, effectively creating fully functional electronics that require little or no assembly.

Consequently, the implementation of this electronics manufacturing trend speeds up prototyping, offers mass customization, and decentralizes parts production. In general, 3D printing technology made possible electronic components production in terms of 3D design and not only 2D, with new ways of stacking the circuits.

Vanguard Photonics provides 3D Nanofabrication for Photonic Integration

German startup Vanguard Photonics offers 3D nanofabrication for photonic integration. The startup’s technology overcomes key challenges of large-scale photonic integration and system assembly by enabling in situ printing of facet-attached beam-shaping elements.

The technology also enables precise adaptation of vastly dissimilar mode profiles and permits alignment tolerances compatible with cost-efficient passive assembly techniques. The startup automates the assembly of photonic multi-chip systems with high performance and versatility.

ATLANT 3D Nanosystems offers Atomic Layer 3D Printing Technology

Danish startup ATLANT 3D Nanosystems develops atomic layer 3D printing technology. It enables materials, devices, and microsystem development and manufacturing with atomic precision. The startup’s technology is capable of performing printing on simple and complex surfaces, atom-by-atom.

Hence, it enables multi-material, atomically precise, and highly scalable atomic layer manufacturing for rapid prototyping and manufacturing of micro and nanodevices.

10. Immersive Technologies

There is a high dependency on the human workforce in different stages of electronics manufacturing. There are possibilities for human errors and it definitely affects the overall manufacturing efficiency. The adoption of immersive technologies is an effective solution to overcome these challenges. Such solutions inspect design objects at all possible scales, thereby eliminating defects in products at the design stage.

Specifically, they detect design errors in the circuitry as well as common manufacturing errors ranging from slivers, missing solder pads, and starved terminals, before fabrication. In addition, it facilitates personnel training, prototype development, and assembly maintenance, and enables operators to visualize workflows.

inspectAR offers Augmented Reality Toolkit For PCB Inspection

Canadian startup inspectAR provides an AR toolkit for PCB manufacturing and workflow testing. It takes the PCB design information and then matches it to calibration images of the PCB sample using AR. The software, along with the toolkit, determines the position of the PCB.

Further, it checks the board through the augmented reality format. This allows electronics companies to inspect, debug, rework, and assemble PCBs in lesser time without mistakes or frustration, thus increasing productivity.

Misterine provides AR-based Assembly Assistance

Misterine is a Czech startup that offers augmented reality software for assembly lines. The startup’s solution visually supports complicated assembly procedures with step-by-step instructions. Also, the system is interactive and the computer vision capability immediately detects errors to provide notifications to its users.

Hence, the startup’s software eliminates human errors, reduces the overall workload, and increases the efficiency of assembly practices.

Discover More Electronics Manufacturing Trends, Technologies & Startups

These electronics manufacturing trends promote the transition into adaptive and smart manufacturing practices. In general, the future manufacturer’s major focus is to build efficient and miniaturized components for specialized applications. The use of advanced materials and the adoption of advanced packaging and printing technologies for fabrication helps achieve these goals. Similarly, the transition to organic electronics allows companies to address the global concern about electronic waste and sustainability. Other innovations are also influencing the industry, such as big data and analytics, to improve the decision-making process.

The Top 10 Electronics Industry Trends & Startups outlined in this report only scratch the surface of trends that we identified during our in-depth innovation and startup scouting process. Among others, additive manufacturing and organic electronics, as well as miniaturized electronics and embedded systems will transform the sector as we know it today. Identifying new opportunities and emerging technologies to implement into your business goes a long way in gaining a competitive advantage. Get in touch to easily and exhaustively scout relevant technologies & startups that matter to you today!

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Auburn establishes Electronics Packaging Research Institute

Published: Aug 19, 2024 9:55 AM

By Jeremy Henderson

Auburn University's seminal work on semiconductor packaging has new packaging of its own — the Auburn University Electronics Packaging Research Institute (EPRI).

The institute’s recent establishment marks a significant new emphasis on the semiconductor packaging research conducted through Auburn's Center of Advanced Vehicle and Extreme Environment Electronics, or CAVE3, which was founded in 1999 through funding from the National Science Foundation and support from select companies focusing primarily on automotive electronics.   Pradeep Lall, John and Anne MacFarlane Endowed Distinguished Professor and Alumni Professor in the Department of Mechanical Engineering, has directed the center since 2008. He will continue to serve as director of EPRI.

“Our need for domestic capability in manufacturing, research and development for semiconductor packaging has really entered the national conversation recently with the recent establishment of the National Advanced Packaging Manufacturing Program (NAPMP) under the Creating Helpful Incentives to Produce Semiconductors — or CHIPS — Act,” Lall said. 

In June 2021, the White House identified four key product areas of vulnerability, with semiconductor manufacturing and advanced packaging topping the list.

The report recognized the role of semiconductor packaging as an important avenue for innovation in the density and size of electronic products; the U.S. global share of semiconductor production has dropped from 37 percent in 1990 to only 12 percent today. 

“In this current environment, we’re realizing the criticality of electronics in general and semiconductor packaging in particular for securing the supply chain and enabling advanced system functionality both in the U.S. and Europe,” Lall said.

Under Lall’s leadership, Auburn’s work along these lines has grown exponentially, especially over the past decade.

In 2015, he led the Auburn team contributing to the winning proposal that resulted in the foundation of the NextFlex National Manufacturing Institute. Auburn is a tier-1 founding member of NextFlex, whose mission is to advance U.S. manufacturing of flexible hybrid electronics; Lall serves on the NextFlex technical council and has previously served on the governing council of the institute.

“Growing CAVE3 into the Auburn University Electronics Packaging Research Institute was the logical next step for our activities in this important area of research," said Dean of Engineering Mario Eden. "It's recognition of its broadened focus, breadth of sponsored research, as well as its international standing.” Steve Taylor, senior vice president for research and economic development, agrees. "This expansion reflects not only Auburn's ever-widening range of research areas, but it will also increase the resources and capabilities to further our mission of advancing electronics packaging technologies and solidifying our reputation as a global leader in the field," Taylor said. In accordance with its expanded scope, EPRI will partner with several campus offices and colleges, including the Auburn University Research and Technology Park (ARTP), the College of Science and Mathematics, the Samuel Ginn College of Engineering and the Auburn Office of AVP Economic Development. EPRI will interface with ARTP for technology commercialization, and with small and medium-sized companies across the state and nation for education pertaining to workforce development. Economic Workforce Development (EWD) will be explicitly pursued in the field of electronic packaging through an interface with the Office of AVP of Economic Development.   “We look with excitement to the future as Auburn University, through EPRI, looks to contribute to the national focus on advanced electronics manufacturing with a broader emphasis on workforce development, new product launch and technology commercialization,” Lall said.

Pradeep Lall, the MacFarlane Endowed Distinguished Professor and Alumni Professor of mechanical engineering, displays an in-mold galvanic skin response sensor for automotive applications additively manufactured at the Auburn University Electronics Packaging Research Institute.

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• making old new again: researchers at uno and doe lab work to upcycle

CAMPUS NEWS: AUGUST 28, 2024

Upcycling batteries, making old new again: researchers at uno and doe lab work to upcycle spent rechargeable batteries.

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UNO doctoral student Kirsten Jones is leading research that explores methods to recover and reuse critical components of expired lithium-ion rechargeable batteries.

Researchers in the Department of Chemistry and the  Advanced Materials Research Institute  at the University of New Orleans are working with scientists from the Department of Energy’s  Sandia National Laboratories  in Albuquerque, NM on upcycling rechargeable batteries.

Led by UNO doctoral student Kirsten Jones, along with UNO professor John Wiley and Clare Davis-Wheeler Chin of Sandia National Laboratories, they are exploring methods to recover and reuse critical components of expired lithium-ion rechargeable batteries. Strategic elements like lithium and cobalt are contained within the batteries and huge cost savings could be realized if scientists can find effective routes for repurposing spent cells.

After Jones carried out a 3-month internship in Chin’s lab in Albuquerque, UNO earned a $20,000 grant to continue the work with Sandia National Laboratories.

“Success could go far to advance clean energy by not only recycling, but upcycling lithium-ion batteries to make them more useful,” said Jones, who is a 5th year Ph.D. student working in Wiley’s lab.

Wiley is a President’s Research Professor, Charles J. O'Connor Ph.D. Endowed Professor in Chemistry and UNO Foundation Endowed Professor in Materials Chemistry, and the director of the Advanced Materials Research Institute. Davis-Wheeler Chin is an electronics engineer at the Microsystems Engineering, Science and Applications (MESA) – Sandia National Laboratories , and a UNO alumna who earned her chemistry doctorate in 2018.

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United in green: a bibliometric exploration of renewable energy communities.

1. Introduction

• SQ1: How did the publication of scientific articles evolve during the analyzed timespan?
• SQ2: Which are the countries with the most articles published?
• SQ3: Taking into consideration the papers published on the REC domain, who are the authors with the most significant impact?
• SQ4: Which are the journals with the most articles published on RECs?
• SQ5: Which are the most relevant universities?
• SQ6: What does the collaboration network between authors look like for the REC domain?

2. Materials and Methods

• Index Chemicus (IC): 2010–present;
• Book Citation Index—Science (BKCI-S): 2010–present;
• Book Citation Index—Social Sciences and Humanities (BKCI-SSH): 2010–present;
• Social Sciences Citation Index (SSCI): 1975–present;
• Arts and Humanities Citation Index (A&HCI): 1975–present;
• Current Chemical Reactions (CCR-Expanded): 2010–present;
• Conference Proceedings Citation Index—Social Sciences and Humanities (CPCI-SSH): 1990–present;
• Emerging Sources Citations Index (ESCI): 2005–present;
• Conference Proceedings Citation Index—Science (CPCI-S): 1990–present;
• Science Citation Index Expanded (SCIE): 1900–present;

3. Dataset Analysis

3.1. data description, 3.2. sources, 3.3. authors, 3.4. countries, 3.5. most-cited documents, 3.6. most-used words, 3.7. collaboration analysis, 3.8. theme analysis, 3.9. mixed analysis, 4. discussions and limitations, 5. conclusions.

• The domain has evolved significantly, especially in recent years. The first paper was released in 1996, and the second one appeared in 2009, but starting with 2019, the domain grew exponentially. More and more researchers are becoming interested in the REC domain, especially from Europe, with a total of 200 publications.
• The most relevant countries that focused on the REC domain when considering the number of articles published and the total citations are Italy, Austria, Germany, Portugal, the Netherlands, the USA, and Canada. EU countries have shown a high level of interest in this area starting in 2021, when the EU adopted the legislation related to new energy sources. Similar results were discovered by Mentel et al. and Cruz-Lovera et al. [ 96 , 100 ].
• The most notable authors in the REC domain when taking into consideration the number of articles published are Ceglia F., Fina B., Marrasso E., Sasso M., Auer H, Krug M., and Lowitzsch J.; all the aforementioned authors published at least five documents indexed in the WoS database.
• The most important journal in the REC area is Energies , which published a total number of 44 papers. Other relevant journals are Sustainability , Renewable Energy , Energy , Applied Energy , Energy Policy , Energy Research & Social Science , the Journal of Cleaner Production , Renewable & Sustainable Energy Reviews , and Energy Conversion and Management . Moreover, in terms of the sources quartile, it has been noted that SCIE dominates in the high-impact quartile (Q1), reflecting its strength in covering top-tier scientific journals. SSCI also shows a strong presence in Q1, but to a lesser extent. Additionally, it can be observed that ESCI shows more journals in the Q2, Q3, and Q4 quartiles, which could indicate a focus on emerging or niche fields that are still developing their impact.
• The foremost affiliations in terms of the number of papers published are predominantly from Italy, including Sapienza University of Rome, the Polytechnic University of Turin, the Polytechnic University of Milan, the University of Sannio, and the University of Pisa. Austria is represented by 2 universities in the top 10 most productive universities based on the number of published papers: Technische Universität Wien and the Austrian Institute of Technology (AIT). Similarly, Germany also features two universities: European University Viadrina Frankfurt ODER and Fraunhofer Gesellschaft. Portugal is represented by Universidade de Lisboa as the sole institution in the top affiliations list for REC research.
• The collaboration network for authors in the domain of RECs predominantly involves researchers from the same countries, as indicated by the high values of the Single-Country Publication (SCP) indicator among the top ten most significant countries, with values ranging from 20% to 90.90%. Exceptions to this trend include France, the Netherlands, and Belgium, which have more publications involving international co-authors, indicating the emergence of French, Dutch, and Belgian researchers in the REC domain. In contrast, countries such as Italy, Austria, Germany, Portugal, Spain, the USA, and China primarily focus on domestic collaborations. Among bilateral collaborations, the most significant is between Germany and the Netherlands with seven publications, followed by Germany and Belgium with five articles. Other notable collaborations include Italy–Spain, Austria–Belgium, Belgium–the Netherlands, Germany–Norway, Germany–Portugal, Germany–Spain, Italy–Poland, and Italy–the UK. Belgium and the Netherlands stand out for their extensive international collaborations, contributing significantly to the development of RECs by exploring new implementation methods and understanding the legislative and decentralization aspects of energy systems. The collaborative network has had a notable impact on discovering new methods of sustainable and affordable energy sources, highlighting the contributions of key authors working in this domain.

Author Contributions

Data availability statement, conflicts of interest.

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Share and Cite

Domenteanu, A.; Delcea, C.; Florescu, M.-S.; Gherai, D.S.; Bugnar, N.; Cotfas, L.-A. United in Green: A Bibliometric Exploration of Renewable Energy Communities. Electronics 2024 , 13 , 3312. https://doi.org/10.3390/electronics13163312

Domenteanu A, Delcea C, Florescu M-S, Gherai DS, Bugnar N, Cotfas L-A. United in Green: A Bibliometric Exploration of Renewable Energy Communities. Electronics . 2024; 13(16):3312. https://doi.org/10.3390/electronics13163312

Domenteanu, Adrian, Camelia Delcea, Margareta-Stela Florescu, Dana Simona Gherai, Nicoleta Bugnar, and Liviu-Adrian Cotfas. 2024. "United in Green: A Bibliometric Exploration of Renewable Energy Communities" Electronics 13, no. 16: 3312. https://doi.org/10.3390/electronics13163312

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Consumer Electronics Trends: Key Insights from H2 2024

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Samsung electronics, q2 fy2024 financial research brief.

Dublin, Aug. 29, 2024 (GLOBE NEWSWIRE) -- The "Samsung Electronics Co., Ltd. Q2 FY2024 Financial Research Brief" report from EJL Wireless Research has been added to ResearchAndMarkets.com's offering.

This report delivers an in-depth financial and strategic analysis of Samsung Electronics Co., Ltd.'s Q2 2024 financial results, specifically focusing on the performance of Samsung Networks. Covering the period from April 1 to June 30, the report provides a detailed financial analysis of Samsung's quarterly results, examining key financial indicators and overall company performance.

It includes a strategic evaluation of regional performance, assessing how various markets contributed to Samsung's financial outcomes. The analysis also focuses on the Networks segment, offering insights into its financial performance and strategic initiatives during the quarter. The report concludes with the analyst's research perspective, providing expert insights and interpretations of Samsung Networks' performance and strategic direction in Q2 2024.

KEY TOPICS COVERED

Financial Research Brief

Methodology

Financial Results

Samsung Networks Financial Performance Analysis

Samsung Networks Operator Customers

Open RAN/vRAN Opportunities

Samsung Electronics Co., Ltd. Management 2H 2024 Outlook

Analyst's Research Perspective

Financial Metrics (KRW Trillion), Q1 2023 - Q2 2024

Segment Sales (KRW Trillion), Q1 2023 - Q2 2024

Segment Sales (As a % of total), Q1 2023 - Q2 2024

Segment Sales (KRW Trillion), 1H 2023 - 1H 2024

DX Division 2H 2024 Guidance

DS/SDC/Harman Divisions 2H 2024 Guidance

Business Division Sales (KRW Trillion), Q1 2023 - Q2 2024

MX/Networks Business Unit Sales (KRW Trillion), Q1 2021 - Q2024

Networks Business Segment Sales (KRW Trillion), Q1 2021 - Q2024

For more information about this report visit https://www.researchandmarkets.com/r/6q1j7d

About ResearchAndMarkets.com ResearchAndMarkets.com is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.

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Electrical and electronic engineering articles within Scientific Reports

Article 29 August 2024 | Open Access

Research on extremely low frequency electromagnetic wave model and simulation in wellbore communication

•  &  Quanbin Wang

Numerical simulation of cable sheath damage detection based on torsional mode guided wave

• , Cheng Liu
•  &  Wenlong Chen

Design and development of an intelligent zone based master electronic control unit for power optimization in electric vehicles

• A. Prabhakaran
• , P. Thirumoorthi
•  &  K. Sri Dhivya Krishnan

Machine-learning-aided method for optimizing beam selection and update period in 5G networks and beyond

• Ludwing Marenco
• , Luiz E. Hupalo
•  &  Felipe A. P. de Figueiredo

Article 28 August 2024 | Open Access

Computer vision based cargo boxes pose adjustment system for two-dimensional conveyor platform

• , Hui Zhang
•  &  Linhan Ma

Spring toy-inspired soft robots with electrohydraulic actuators

• , Joohyeon Kang
•  &  Youngsu Cha

Article 27 August 2024 | Open Access

PCB plug-in solder joint defect detection method based on coordinated attention-guided information fusion

• Wenbin Chen
• , Zheng Wang
•  &  Hongchao Zhao

Smart customer service in unmanned retail store enhanced by large language model

• , Ping Zhang
•  &  Dengchao Feng

Finite control set model predictive current control for three phase grid connected inverter with common mode voltage suppression

• Ali Bebboukha
• , Redha Meneceur
•  &  Mohit Bajaj

New control model for autonomous vehicles using integration of Model Predictive and Stanley based controllers

• Mustafa Hamid Al-Jumaili
•  &  Yasa Ekşioğlu Özok

Additional fractional gradient descent identification algorithm based on multi-innovation principle for autoregressive exogenous models

• Zishuo Wang
• , Shuning Liang
•  &  Hongliang Sun

Conceptional design for a universal HVDC-HVAC vacuum-interrupter-based circuit breaker

•  &  Tamer Eliyan

Article 26 August 2024 | Open Access

An emotion-sensitive dialogue policy for task-oriented dialogue system

•  &  Kai Xv

A novel development of hybrid maximum power point tracking controller for solar pv systems with wide voltage gain DC-DC converter

• R. Udayanan
• , S. Chitraselvi
•  &  N. Ramanujam

Article 24 August 2024 | Open Access

Rotation insensitive implantable wireless power transfer system for medical devices using metamaterial-polarization converter

• Tarakeswar Shaw
• , Bappaditya Mandal
•  &  Robin Augustine

Article 23 August 2024 | Open Access

A novel image semantic communication method via dynamic decision generation network and generative adversarial network

• Shugang Liu
• , Zhan Peng
•  &  Linan Duan

An experimental and spectroscopic investigation on pongamia pinata as liquid dielectrics for rural micro grid under various load conditions

• Lalith Pankaj Raj Nadimuthu
• , Nisha Sathiya Moorthy
•  &  Ahmed Ali

Enhancing YOLO for occluded vehicle detection with grouped orthogonal attention and dense object repulsion

• , Huaixin Chen
•  &  Jie Liu

Evaluation of perceived urgency from single-trial EEG data elicited by upper-body vibration feedback using deep learning

• Haneen Alsuradi
• , Jiacheng Shen
•  &  Mohamad Eid

Article 22 August 2024 | Open Access

AC breakdown and decomposition products detection characteristics of eco-friendly insulating medium in gas insulated switchgear

• , Xian Cheng
•  &  Sai Liu

The control method of a quadrotor driven by bidirectional electronic speed controllers

• , Zhiduan Cai
•  &  Zhongyi Shen

Improved efficacy behavioral modeling of microwave circuits through dimensionality reduction and fast global sensitivity analysis

• Slawomir Koziel
• , Anna Pietrenko-Dabrowska
•  &  Leifur Leifsson

Article 21 August 2024 | Open Access

Multi frame holograms batched optimization for binary phase spatial light modulators

• , Antoni Wojcik
•  &  Timothy D. Wilkinson

Context-embedded hypergraph attention network and self-attention for session recommendation

• Zhigao Zhang
• , Hongmei Zhang
•  &  Bin Wang

A hybrid deep learning approach to solve optimal power flow problem in hybrid renewable energy systems

• G. Gurumoorthi
• , S. Senthilkumar
•  &  Faisal Alsaif

Article 20 August 2024 | Open Access

Quality characterization of tobacco flavor and tobacco leaf position identification based on homemade electronic nose

• , Qiuling Wang
•  &  Gaolei Xi

Connected smart elevator systems for smart power and time saving

• Ahmed Nabih Zaki Rashed
• , Manasa Yarrarapu
•  &  Shaik Hasane Ahammad

Optimal routing and end-to-end entanglement distribution in quantum networks

• , Akhmadjon Rajabov
•  &  Gerhard P. Fettweis

Investigating small sized metal blockage effects at 60 and 100 GHz using measurements and modeling approaches

• Fahd Alsaleem
• , Amr Ragheb
•  &  Saleh Alshebeili

Article 19 August 2024 | Open Access

PV integrated multi-leg powered constant quasi-dynamic charging system for low-speed vehicles

• Yuvaraja Shanmugam
• , Narayanamoorthi Rajamanickam
•  &  Petr Moldrik

Machine learning-based energy management and power forecasting in grid-connected microgrids with multiple distributed energy sources

• Arvind R. Singh
• , R. Seshu Kumar
•  &  Ievgen Zaitsev

Harmonic errors of a 9.4 T all-REBCO NMR magnet affected by screening current and geometric inconsistency of coated conductors

• Jeseok Bang
• , Jaemin Kim
•  &  SangGap Lee

Sidelobes and sideband minimization in time-modulated array antenna based on chaotic exchange nonlinear dandelion optimization algorithm

•  &  Kui Hu

Acoustic modulation signal recognition based on endpoint detection

• , Wang Zhen
•  &  Li Zhenfei

Article 16 August 2024 | Open Access

Metaheuristics based dimensionality reduction with deep learning driven false data injection attack detection for enhanced network security

• Thavavel Vaiyapuri
• , Huda Aldosari
•  &  Woong Cho

Chaotic self-adaptive sine cosine multi-objective optimization algorithm to solve microgrid optimal energy scheduling problems

• , Arul Rajagopalan
•  &  Lukas Prokop

QACDes: QoS-aware context-sensitive design of cyber-physical systems

• Subhajit Sidhanta
• , Chanachok Chokwitthaya
•  &  Supratik Mukhopadhyay

Article 13 August 2024 | Open Access

Lyapunov-based neural network model predictive control using metaheuristic optimization approach

• Chafea Stiti
• , Mohamed Benrabah
•  &  Kamel Kara

Article 12 August 2024 | Open Access

A new dataset for video-based cow behavior recognition

• , Daoerji Fan
•  &  Aruna Zhao

Article 11 August 2024 | Open Access

Tunable active noise control circuit topology for multiple-feature applications

• Tak Chun Kwong
• , Yat Sze Choy
•  &  Steve W. Y. Mung

A novel double stator hybrid-excited Halbach permanent magnet flux-switching machine for EV/HEV traction applications

• Shichao Ning
• , Pattasad Seangwong
•  &  Pirat Khunkitti

Slice-aware 5G network orchestration framework based on dual-slice isolation and management strategy (D-SIMS)

• Sujitha Venkatapathy
• , Thiruvenkadam Srinivasan
•  &  In-Ho Ra

Article 10 August 2024 | Open Access

A novel active cell balancing topology for serially connected Li-ion cells in the battery pack for electric vehicle applications

• , Chia Ai Ooi
•  &  Mohamad Khairi Ishak

Defect monitoring method for Al-CFRTP UFSW based on BWO–VMD–HHT and ResNet

• Haiwei Long
•  &  Xinhua Yang

High pressure sensor based on intensity-variation using polymer optical fiber

• Abdul Ghaffar
•  &  Mujahid Mehdi

UAV propeller fault diagnosis using deep learning of non-traditional χ 2 -selected Taguchi method-tested Lempel–Ziv complexity and Teager–Kaiser energy features

• Luttfi A. Al-Haddad
• , Wojciech Giernacki
•  &  Sinan A. Al-Haddad

Article 09 August 2024 | Open Access

Trajectory optimization of UAV-IRS assisted 6G THz network using deep reinforcement learning approach

• Amany M. Saleh
• , Shereen S. Omar
•  &  Mostafa M. Abdelhakam

Motion/force coordinated trajectory tracking control of nonholonomic wheeled mobile robot via LMPC-AISMC strategy

• , Kunxi Tang
•  &  Xiaowei Chen

Article 08 August 2024 | Open Access

Implementing heuristic-based multiscale depth-wise separable adaptive temporal convolutional network for ambient air quality prediction using real time data

• Raj Anand Sundaramoorthy
• , Antony Dennis Ananth
•  &  Shitharth Selvarajan

Article 07 August 2024 | Open Access

H-plane gap-RGW horn antenna with very low side lobe level

• Mohammad Mohammadpour
• , Farzad Mohajeri
•  &  Seyed Ali Razavi Parizi

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Research Daily

Top Research Reports for American Express, ServiceNow & RTX

AXP Quick Quote AXP FIS Quick Quote FIS MPLX Quick Quote MPLX NOW Quick Quote NOW FEIM Quick Quote FEIM RTX Quick Quote RTX

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Today's Must Read

Strong card member spending aids amex (axp) amid high costs, growing customer base & partnerships aid servicenow (now), solid order growth aids rtx, rising crude oil price woes.

Thursday, August 29, 2024 The Zacks Research Daily presents the best research output of our analyst team. Today's Research Daily features new research reports on 16 major stocks, including American Express Company (AXP), ServiceNow, Inc. (NOW) and RTX Corporation (RTX), as well a micro-cap stocks Frequency Electronics, Inc. (FEIM).  The Zacks microcap research is unique as our research content on these small and under-the-radar companies is the only research of its type in the country. These research reports have been hand-picked from the roughly 70 reports published by our analyst team today. You can see all of today’s research reports here >>> Shares of American Express have outperformed the Zacks Financial - Miscellaneous Services industry over the past year (+63.6% vs. +23.4%). The company’s growth initiatives, like launching new products, reaching new agreements and forging alliances, are boosting its revenues.  Consumer spending on travel and entertainment, which carries higher margins for AmEx, is advancing well. It beat Q2 earnings estimates. Its solid cash-generation abilities enable the pursuit of business investments and prudent deployment of capital via buybacks and dividends.  However, with higher utilization of AXP’s cards, costs in the form of card member services and card member rewards are likely to go up. Rising marketing costs are straining its margins. Its current debt level amid a high-interest rate environment induces a rise in interest expenses. The stock is overvalued at the moment. As such, the stock warrants a cautious stance. (You can read the full research report on American Express here >>> ) ServiceNow shares have outperformed the Zacks Computers - IT Services industry over the year-to-date period (+19.0% vs. +3.6%). The company has been benefiting from the rising adoption of its workflows by enterprises undergoing digital transformation.  ServiceNow had 1,988 total customers with more than $1 million in annual contract value (ACV) at the end of second quarter, which represents 15% year-over-year growth in customers. ServiceNow had 14 deals greater than $5 million in net new ACV and four deals of more than $10 million. It closed 88 deals greater than $1 million net new ACV.  Generative AI deals continued to gain traction with net new ACV for Now Assist and was part of 11 deals worth more than $1 million in the reported quarter. It is riding on an expanding partner base. Nevertheless, ServiceNow is suffering from persistent inflation, stiff competition, and a challenging macroeconomic environment. (You can read the full research report on ServiceNow here >>> ) Shares of RTX have outperformed the Zacks Aerospace - Defense industry over the past year (+44.1% vs. +0.3%). The company ended second-quarter 2024 on a solid note, with both its revenues and earnings having surpassed their respective Zacks Consensus Estimate. It continues to receive ample orders for its wide range of combat-proven defense products.  A steadily recovering commercial air traffic has been bolstering commercial OEM as well as commercial aftermarket sales for the company. RTX holds a solid financial position, which enables it to make successful share repurchases.  However, rising crude price tends to put cost pressure on airlines that may affect the operating results of commercial OEM producers like RTX. The company may also be affected if China enforces its announced sanctions against its missile and defense unit. Supply-chain challenges also pose a threat to RTX. (You can read the full research report on RTX here >>> ) Frequency Electronics shares have outperformed the Zacks Instruments - Control industry over the year-to-date period (+41.8% vs. +10.9%). This microcap company with market capitalization of $135.62 million posted strong financial results in FY 2024, with revenue rising 36% to $55.3 million, driven by U.S. Government satellite programs and DOD customers.  Frequency Electronics turned a $5.5 million net loss in FY 2023 into a $5.6 million net income, reflecting robust revenue growth, effective cost management and overcoming technical challenges. A record $78 million backlog ensures revenue visibility and supports business momentum. Positioned strategically in the growing satellite payload market, Frequency Electronics is capitalizing on demand for low and medium Earth orbit satellites.  A debt-free balance sheet with $27 million in working capital provides flexibility for growth, while a $1.00 per share special dividend underscores shareholder value. However, the shift to cost-sensitive contracts pressures margins, and dependence on government contracts adds revenue uncertainty. (You can read the full research report on Frequency Electronics here >>> ) Other noteworthy reports we are featuring today include Fidelity National Information Services, Inc. (FIS), MPLX LP (MPLX) and Datadog, Inc. (DDOG). Director of Research Sheraz Mian Note: Sheraz Mian heads the Zacks Equity Research department and is a well-regarded expert of aggregate earnings. He is frequently quoted in the print and electronic media and publishes the weekly Earnings Trends and Earnings Preview reports. If you want an email notification each time Sheraz publishes a new article, please click here>>>

Featured Reports

Datadog (ddog) banks on cloud partnerships, customer additions.

Per the Zacks Research analyst, Datadog is benefitting from expanding customer base driven by increased adoption of its cloud-based monitoring and analytics platform.

TELUS (TU) Benefits from Increasing Subscriber Engagements

Per the Zacks analyst, TELUS' performance is cushioned by the continued expansion of its subscriber base. Softness across the TELUS Digital segment remains a woe.

Market Adoption Aids Zimmer Biomet (ZBH) amid Macro Issues

The Zacks analyst is impressed with Zimmer Biomet's solid market share gains banking on new launches across all wings. Yet, macroeconomic woes in the form of supply and staffing shortages dent profit.

Improving Volumes to Aid Ball Corporation (BALL), Costs Ail

The Zacks analyst believes improving volumes in North America and EMEA along with its focus on driving operating efficiency and productivity will negate the impact of elevated costs on its results.

WEX Benefits From Payzer Acquisition Amid Low Liquidity

Per the Zacks Analyst, the Payzer buyout aids WEX's growth strategy, offering scalable SaaS to 150,000 small business customers. Liquidity decline is a woe.

Asset Growth Aids Invesco (IVZ), High Level of Goodwill Hurt

Per the Zacks analyst, Invesco's diverse product offerings and rising assets under management will aid revenues. The presence of high levels of goodwill on its balance sheet is a woe.

Build-To-Order Model Aids Toll Brothers (TOL), High Costs Ail

Per the Zacks analyst, Toll Brothers is benefiting from its Build-To-Order model and and land acquisition strategies. However, supply constraint and high-cost environment are concerning.

New Upgrades

Strong organic growth and buyouts aid fidelity national (fis).

Per the Zacks analyst, the strong performance of Fidelity National's Merchants Solution segment is driving revenues. Acquisitions continue to boost its presence across several regions.

Focus on Expansion Initiatives to Benefit MPLX LP (MPLX)

Per the Zacks analyst, MPLX's robust capital expenditure forecast for 2024, with a significant portion dedicated to expansion initiatives, should support its long-term growth.

Growing Top Line, Solid Capital Position Aid Palomar (PLMR)

Per the Zacks analyst, Palomar's growing revenues driven by higher premiums and net investment income have led to significant growth. Moreover, robust capital position supports capital deployment.

New Downgrades

Ironwood's (irwd) overdependence on linzess poses concern.

Per the Zacks analyst, Ironwood's heavy dependence on its sole marketed drug Linzess for growth is a woe. Also, competition for Linzess in the target market is intensifying, which is an overhang.

Soft Demand to Hurt Capri Holdings (CPRI) Top Line

Per the Zacks analysts, softness in demand for luxury fashion items is likely to hurt Capri Holdings top line. The company is seeing sluggishness across its brands.

Lamb Weston's (LW) Volumes Hurt by Soft Restaurant Traffic

Per the Zacks analyst, Lamb Weston is battling soft volumes. In the fourth quarter of fiscal 2024, volumes fell 8% due to weak restaurant traffic as consumers are still adapting to higher menu prices.

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